Design and simulation analysis of an electrostatic actuator for improving the performance of scanning probe nanolithography

Le Van Tam, Dang Van Hieu, Nguyen Duy Vy, Vu Ngoc Hung, Chu Manh Hoang
Author affiliations

Authors

  • Le Van Tam International Training Institute for Materials Science, Hanoi University of Science and Technology, No. 1, Dai Co Viet, Hai Ba Trung, Hanoi, Viet Nam
  • Dang Van Hieu International Training Institute for Materials Science, Hanoi University of Science and Technology, No. 1, Dai Co Viet, Hai Ba Trung, Hanoi, Viet Nam
  • Nguyen Duy Vy Ton Duc Thang University
  • Vu Ngoc Hung Theoretical Physics Research Group, Ton Duc Thang University, Ho Chi Minh City 756636, Vietnam
  • Chu Manh Hoang International Training Institute for Materials Science, Hanoi University of Science and Technology, No. 1, Dai Co Viet, Hai Ba Trung, Hanoi, Viet Nam

DOI:

https://doi.org/10.15625/2525-2518/55/4/8803

Keywords:

Electrostatic actuator, symmetrical operation mode, scanning probe lithography

Abstract

In this paper, we design and simulate a micro-suspension based scanning probe for nanolithography using electrostatic actuation. The probe consists of a square plate with a pyramid tip at the center that is suspended by four beams. The entire probe is made of single silicon and is operated in air medium. Operation characteristics are analyzed by finite element method. The operation mode is symmetrical that overcomes the lateral displacement in the unsymmetrical operation mode of conventional scanning probe nanolithography, hence increasing the precision in lithographed nanostructures. The effect of electric field fringe and fixed electrode to the operation of the scanning probe are also analyzed in detail.

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Published

21-08-2017

How to Cite

[1]
L. V. Tam, D. V. Hieu, N. D. Vy, V. N. Hung, and C. M. Hoang, “Design and simulation analysis of an electrostatic actuator for improving the performance of scanning probe nanolithography”, Vietnam J. Sci. Technol., vol. 55, no. 4, pp. 484–493, Aug. 2017.

Issue

Vol. 55 No. 4 (2017)

Section

Materials

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