The numerical calculation of statically admissible slip-line field for plane strain compression of a three-layer symmetric strip between rigid plates

Nguyen Manh Thanh, Kien Trung Nguyen, Sergei Alexandrov
Author affiliations

Authors

  • Nguyen Manh Thanh Institute of Mechanics, Vietnam Academy of Science and Technology, No.264 Doi Can Street, Ba Dinh District, Ha Noi, Viet Nam
  • Kien Trung Nguyen University of Communications and Transport, No.3 Cau Giay Street, Lang Thuong ward,Dong Da District, Ha Noi, Viet Nam
  • Sergei Alexandrov Institute for Problems in Mechanics, Russian Academy of Sciences,Prospekt Vernadskogo,101-1, Moscow 119526, Russia

DOI:

https://doi.org/10.15625/2525-2518/59/1/15261

Keywords:

piece-wise homogeneous materials, rigid perfectly plastic materials, maximum friction surface, method of characteristics.

Abstract

This paper present a method to build up statically admissible slip-line field (the field of characteristics) and, as a result, the field of statically admissible stresses of the compression of a three-layer symmetric strip consisting of two different rigid perfectly plastic materials between rough, parallel, rigid plates (for the case: the shear yield  stress of the inner layer is greater than that of the outer layer). Under the conditions of sticking regime at bi-material interfaces and sliding occurs at rigid surfaces with maximum friction, the appropriate singularities on the boundary between the two materials have been assumed, then a standard numerical slip-line technique is supplemented with iterative procedure to calculate characteristic and stress fields that satisfy simultaneously the stress boundary conditions as well as the regime of sticking on the bi-material interfaces

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Published

15-01-2021

How to Cite

[1]
N. M. Thanh, K. T. Nguyen, and S. Alexandrov, “The numerical calculation of statically admissible slip-line field for plane strain compression of a three-layer symmetric strip between rigid plates”, Vietnam J. Sci. Technol., vol. 59, no. 1, pp. 120–134, Jan. 2021.

Issue

Section

Mechanical Engineering - Mechatronics

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