Fabrication and characterization of micromachined piezoresistive displacement sensors
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DOI:
https://doi.org/10.15625/0866-708X/48/1/1095Abstract
Summarry
Silicon micromachined displacement sensors have been designed and fabricated successfully by the MEMS group at ITIMS. The structure of the sensors consists of a membrane with a stiff center. The membrane thickness is about 30 microns. The stiff center serves as a forced point and is linked to a movement system. The mechanical signal is converted into output voltage signal by a Wheatstone resistor bridge or a four-terminal gage made by diffusion on the membrane. In this paper, the configuration, fabrication process and characteristics of sensor have been presented.
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