The mechanical, thermo-physical and ultrasonic properties of scandium nitride in B1 and B2 phases

Author affiliations

Authors

  • ANURAG SINGH Department of Physics, Prof. Rajendra Singh (Rajju Bhaiya) Institute of Physical Sciences for Study and Research, Veer Bahadur Singh Purvanchal University, Jaunpur 222003, India https://orcid.org/0009-0001-3877-9510
  • Jyoti bala Department of Physics, Goswami Ganesh Dutta Sanatan Dharma College, Sector 32, Chandigarh 160032, India
  • Devraj Singh Department of Physics, Prof. Rajendra Singh (Rajju Bhaiya) Institute of Physical Sciences for Study and Research, Veer Bahadur Singh Purvanchal University, Jaunpur 222003, India https://orcid.org/0000-0002-3011-2375
  • Shakti Singh Department of Physics, Government Polytechnic, Kuru, Pindra, Varanasi 221206, India

DOI:

https://doi.org/10.15625/2525-2518/20142

Keywords:

Scandium nitride, elastic constants, thermophysical properties, ultrasonic attenuation

Abstract

The mechanical, elastic, thermophysical and nonlinear ultrasonic effect of scandium nitride (ScN) were studied in B1 and B2 both phases at 300K. The working out of the second- and third-order elastic constants (SOECs and TOECs) for ScN were done by using Coulomb and Born-Mayer potential model. The mechanical properties were calculated with the help of SOECs using Voigt–Reuss–Hill approximation. The nonlinear ultrasonic velocities, Debye average velocity and Debye temperature were evaluated with the calculated values of SOECs. The thermophysical properties of ScN were computed along <100>, <110> and <111> crystallographic orientations. Finally, the ultrasonic attenuation along suitable crystallographic direction was calculated in ScN at 300K. The acquired results were compared and discussed with existing findings of the ScN in B1 and B2 both phases.

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Published

28-02-2025

How to Cite

[1]
A. SINGH, Jyoti bala, Devraj Singh, and S. Singh, “The mechanical, thermo-physical and ultrasonic properties of scandium nitride in B1 and B2 phases”, Vietnam J. Sci. Technol., vol. 63, no. 1, pp. 161–175, Feb. 2025.

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Electronics - Telecommunication