Tung BT, Suzuki M, Kato F, Nemoto S, Aoyagi M. Heterogeneous integration approach based on flip-chip bonding and misalignment self-correction elements for electronics-optics integration applications. Vietnam J. Mech. [Internet]. 2012 Nov. 30 [cited 2024 Apr. 20];34(4):289-97. Available from: https://vjs.ac.vn/index.php/vjmech/article/view/1760