Tung, B. T., M. Suzuki, F. Kato, S. Nemoto, and M. Aoyagi. “Heterogeneous Integration Approach Based on Flip-Chip Bonding and Misalignment Self-Correction Elements for Electronics-Optics Integration Applications”. Vietnam Journal of Mechanics, vol. 34, no. 4, Nov. 2012, pp. 289-97, doi:10.15625/0866-7136/34/4/1760.