Tung, B.T., Suzuki, M., Kato, F., Nemoto, S. and Aoyagi, M. 2012. Heterogeneous integration approach based on flip-chip bonding and misalignment self-correction elements for electronics-optics integration applications. Vietnam Journal of Mechanics. 34, 4 (Nov. 2012), 289–297. DOI:https://doi.org/10.15625/0866-7136/34/4/1760.