Prediction of delamination strength at interface between thin film and substrate by cohesive zone model

Authors

  • Do Van Truong Department of Design of Machinery & Robot, Hanoi University of Technology, Vietnam
  • Hiroyuku Hirakata Department of Engineering Physics and Mechanics, Kyoto University, Japan
  • Takayuki Katamura Department of Engineering Physics and Mechanics, Kyoto University, Japan

DOI:

https://doi.org/10.15625/0866-7136/28/4/5585

Abstract

An electronic device consists of multi-layered submicron-thick films, and delamination often takes place at an interface edge because of the stress singularity near the edge. Since the stress singularity at an interface edge depends on the edge shape, the fracture mechanics concept cannot be used to compare the delamination strength between the components with different shapes. This paper aims to predict the delamination strength at the interface edge with arbitrary shape using a cohesive zone model. Two different experiments are conducted for a gold thin film on a silicon substrate to calibrate the cohesive law. The validity of the approach is then discussed.

Downloads

Download data is not yet available.

Metrics

Metrics Loading ...

Downloads

Published

31-12-2006

How to Cite

Truong, D. V., Hirakata, H., & Katamura, T. (2006). Prediction of delamination strength at interface between thin film and substrate by cohesive zone model. Vietnam Journal of Mechanics, 28(4), 252–262. https://doi.org/10.15625/0866-7136/28/4/5585

Issue

Section

Articles