Hòa tách đồng kim loại từ bản mạch điện tử bằng dung dịch axit HNO3.

Abstract

With the aim of recovering Cu from waste printed circuit boards (PCBs) in hydrometallurgical route, the HNO₃ leaching of copper containing in the metal enriched fraction collected from previous study was studied. Parameters such as HNO₃ concentration, initial temperature, agitation speed, and pulp density were investigated. The leaching rate of copper was almost independent of agitation speed and mainly dependent on HNO₃ concentration, initial temperature and pulp density. 99% of Cu was leached within 30 minutes at 20% in HNO₃ concentration, 50^oC in initial temperature and 120 g/l in pulp density.