Study of Temperature Effect on Luminous Flux of High Power Chip on Board Light Emitting Diode
Keywords:high power chip on board light emitting diode (HPCOBLED), luminous flux and integrated sphere, chip on Board
High power chip on board light emitting diode (HPCOBLED) are a promising solid state light technology for a variety of lighting applications. In this study, we studied temperature effect on luminous flux of HPCOBLED using VMI-PR-001 system of Vietnam Metrology Institute. The results according to the temperature Tc is increasing, luminous flux reduced. Especially HPCOBLED is larger power, decreasing luminous flux is larger. Reason of this is chance power. HPCOBLED model describes the temperature affection on luminous flux of HPCOBLED. The results of HPCOBLED model matched with that measured by the luminous flux measurement system (VMI-PR-001, Vietnam).
A. I. Zhmakin, “Enhancement of light extraction from light emitting diodes,” Phys. Rep., vol. 498, no. 4-5, pp. 189-241, 2011. DOI: https://doi.org/10.1016/j.physrep.2010.11.001
M.-C. Dubois and Å. Blomsterberg, “Energy saving potential and strategies for electric lighting in future North European, low energy office buildings: A literature review,” Energy Build., vol. 43, no. 10, pp. 2572–2582, Oct. 2011. DOI: https://doi.org/10.1016/j.enbuild.2011.07.001
S. Takamatsu, T. Yamashita, and T. Itoh, “Meter-scale large area LED-embedded light fabric for the application of fabric ceilings in rooms,” Microsyst. Technol., Apr. 2014. DOI: https://doi.org/10.1007/s00542-014-2174-z
S. Dutta Gupta and B. Jatothu, “Fundamentals and applications of light-emitting diodes (LEDs) in in vitro plant growth and morphogenesis,” Plant Biotechnol. Rep., vol. 7, no. 3, pp. 211–220, Mar. 2013. DOI: https://doi.org/10.1007/s11816-013-0277-0
Mary Yamada, Dan Chwastyk, "Adoption of Light-Emitting Diodes in Common Lighting Applications", no. April. U.S.Department of Energy, 2013. DOI: https://doi.org/10.2172/1221117
J. Li, F. Lin, D. Wang, and W. Tian, “A loop-heat-pipe heat sink with parallel condensers for high-power integrated LED chips,” Appl. Therm. Eng., vol. 56, no. 1–2, pp. 18–26, Jul. 2013. DOI: https://doi.org/10.1016/j.applthermaleng.2013.03.016
K. C. Yung, H. Liem, H. S. Choy, and Z. X. Cai, “Thermal investigation of a high brightness LED array package assembly for various placement algorithms,” Appl. Therm. Eng., vol. 63, no. 1, pp. 105–118, Feb. 2014. DOI: https://doi.org/10.1016/j.applthermaleng.2013.11.009
H. Wu, K. Lin, and S. Lin, “A study on the heat dissipation of high power multi-chip COB LEDs,” Microelectronics J., vol. 43, no. 4, pp. 280–287, 2012. DOI: https://doi.org/10.1016/j.mejo.2012.01.007
J. Wang, Y. Cai, X. Zhao, and C. Zhang, “Thermal design and simulation of automotive headlamps using white LEDs,” Microelectronics J., vol. 45, no. 2, pp. 249–255, Feb. 2014. DOI: https://doi.org/10.1016/j.mejo.2013.11.011
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