Heterogeneous integration approach based on flip-chip bonding and misalignment self-correction elements for electronics-optics integration applications

Bui Thanh Tung, Motohiro Suzuki, Fumiki Kato, Shunsuke Nemoto, Masahiro Aoyagi


This paper presents a high precision bonding approach, capable of submicron alignment accuracy, based on the thermosonic flip-chip bonding technique and misalignment self-correction elements. The precision of the bonding technique is guaranteed by using of misalignment self-correction bump (convex) and hollow (concave) elements. Metal cone bump and conductive sloped hollow bonding pad elements are created using micro-machining techniques, on a chip specimen and substrate, respectively. The chip and substrate are bonded face-to-face using of an ultrasonic-enhanced flip-chip bonder. By introducing of misalignment self-correction elements, repeatable bonding accuracies of less than 500 nm were confirmed through experimental investigation. Bond properties, including electrical and mechanical properties, are also characterized to confirm the success of the bonding approach. With the obtained results, the proposed bonding approach is capable of being use in electronics-optics heterogeneous integration applications.


CNTs thin film, sensor, actuator, Seebeck effect, piezoresistive effect, micromirror.

Full Text:


DOI: https://doi.org/10.15625/0866-7136/34/4/1760 Display counter: Abstract : 112 views. PDF : 72 views.


  • There are currently no refbacks.

Copyright (c) 2012 Vietnam Academy of Science and Technology


Editorial Office of Vietnam Journal of Mechanics

3rd Floor, A16 Building, 18B Hoang Quoc Viet Street, Cau Giay District, Hanoi, Vietnam
Tel: (+84) 24 3791 7103
Email: vjmech@vjs.ac.vn