Effects of number of substituents and molecular weight of polyamines on the non-cyanide alkaline zinc plating process

Truong Thi Nam, Le Ba Thang, Le Duc Bao, Nguyen Van Khuong

Abstract


The effects of the number of substituents and molecular weight of polyamines in the non-cyanide alkaline plating bath on the morphology, brightness and bright ranges of zinc electrodeposited coating and cathodic polarization, cyclic voltammogram on the non-cyanide alkaline zinc plating process were investigated. Cathodic polarization measurements showed that the polyamines all increased cathodic polarization of the plating process and shifted the zinc reduced potential to a more negative direction. However, cycle voltammogram curves of the 5 continuous cycles shows that the quaternary polyamine Q7-20 has a more stable adsorption and desorption processes than the secondary polyamine Bt18 has.

Keywords


polyquaternium-7; polyamine (Bt); additive; alkaline non-cyanide zinc plating; zinc coating

Full Text:

PDF

References


T. Ohgai, H. Fukushima, N. Baba, and T. Akiyama. - Effect of polymer additives on zinc electrowinning, in: J.E. Dutrizac, J.A. Gonzalez, D.M. Henke, S.E. James, A.H.‐J. Siegmund (Eds.), Lead‐Zinc 2000, Wiley, 2000, pp. 855-864.

E.Budman. - Alkaline noncyanide zinc plating, Metal Finishing, 93 (2) (1995) 60-63.

Y. A. Naik and T.V. Venkatesha. - A new condensation product for zinc plating from non-cyanide alkaline bath, Bulletin of Materials Science, 28 (2005) 495–501.

Technical documents. ENTHONE OMI. Inc.

U. Haque, A. Khan and M. U. Ahmad. - Additives for bright zinc deposition, Journal of the Chemical Society of Pakistan, 29 (4) (2007) 373-378.

Cliff Biddulph and Michael Marzano. - Zinc plating, Metal Finishing, 98 (1) (2000) 323-333.

JiLing Zhu, YunHong Zhou, and CuiQin Gao. - Influence of surfactants on electrochemical behavior of zinc electrodes in alkaline solution, Journal of Power Sources, 72 (2) (1998) 231-235.

Jose Luis Ortiz-Aparicio, Yunny Meas, Gabriel Trejo, Raiil Ortega, Thomas W. Chapman, and Eric Chainet. - Effects of organic additives on zinc electrodeposition from alkaline electrolytes, Journal of Applied Electrochemistry, 43 (2013) 289-300.

Y.F. Yuan , J.P. Tu, H.M. Wu, S.F. Wang, W.K. Zhang, and H. Huang. - Effects of stannous ions on the electrochemical performance of the alkaline zinc electrode, Journal of Applied Electrochemistry, 37 (2007) 249-253.

Shanmugasigamani and Malathy Pushpavanam. - Role of additives in bright zinc deposition from cyanide free alkaline baths, Journal of Applied Electrochemistry, 36 (2006) 315-322.

M. S. Chandrasekar, Shanmugasigamani Srinivasan, and Malathy Pushpavanam. - Structural and textural study of electrodeposited zinc from alkaline non-cyanide electrolyte, Journal of Materials Science, 45 (2010) 1160-1169.

M.S. Pereira, L.L. Barbosa, C.A.C. Souza, A.C.M. De Moraes, and I.A. Carlos. - The influence of sorbitol on zinc film deposition, zinc dissolution process and morphology of deposits obtained from alkaline bath, Journal of Applied Electrochemistry, 36 (2006) 727-732

Jose Luis Ortiz-Aparicio, Yunny Meas, Thomas W. Chapman, Gabriel Trejo, Raiil Ortega, and Eric Chainet. - Electrodeposition of zinc in the presence of aternary ammonium compounds from alkaline chloride bath, Journal of Applied Electrochemistry, 45 (2015) 67-78.

US.Pat.No.WO 2004/044269 A2.

Rick Holland, and Brett Larick. - The use of alkaline cyanide-free zinc plating under paint and powder coatings. COATING 2003 Technical Conference, Indianapolis, Indiana, 2005.

US.Pat.No.3769183

US.Pat.No.4134804

Truong Thi Nam, Le Ba Thang, Nguyen Thi Cam Ha, Nguyen Quoc Dung, and Hoang Thi Huong Thuy. - Effects of molecular weight of polyamine on the alkaline non-cyanide zinc plating process. Proceedings of ASAM-6, 2017, pp. 616-621.

S. Shanmugasigamani and M. Pushpavanam. - Voltammetric studies on the role of additives in bright zinc electrodeposition from an alkaline non-cyanide bath, Portugaliae Electrochimica Acta 27 (6) (2009) 725-735.

O. Kardos. - Current distribution on microprofiles. Part I, Plating, 61 (2) (1974) 129-138.

H. Leidheiser. - The mechanism of leveling during the electrodeposition of nickel in the presence of organic compounds, Zeitschrift für Elektrochemie, Berichte der Bunsengesellschaft für physikalische Chemie, 59 (7‐8) (1995) 756-766.

S. Kruglikov, Y. D. Gamburg, and N. Kudryavtsev. - The relationship between inhibition of electrodeposition and incorporation of the inhibitor into the deposit, Electrochimica Acta, 12 (8) (1967) 1129-1133.

G. Rogers and K. Taylor. - The effects of coumarin on the electrodeposition of nickel, Electrochimica Acta, 8 (12) (1963) 887-904.




DOI: https://doi.org/10.15625/2525-2518/59/1/15452 Display counter: Abstract : 48 views. PDF : 16 views.

Refbacks

  • There are currently no refbacks.


budidaya tani

Index: Google Scholar; Crossref; VCGate; Asean Citation Index

Published by Vietnam Academy of Science and Technology