Fabrication and characterization of micromachined piezoresistive displacement sensors

Đinh Văn Dũng
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Authors

  • Đinh Văn Dũng Nhà xuất bản Khoa học Tự nhiên và Công nghệ

DOI:

https://doi.org/10.15625/0866-708X/48/1/1095

Abstract

Summarry

Silicon micromachined displacement sensors have been designed and fabricated successfully by the MEMS group at ITIMS.  The structure of the sensors consists of a membrane with a stiff center. The membrane thickness is about 30 microns. The stiff center serves as a forced point and is linked to a movement system. The mechanical signal is converted into output voltage signal by a Wheatstone resistor bridge or a four-terminal gage made by diffusion on the membrane. In this paper, the configuration, fabrication process and characteristics of sensor have been presented.

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Published

22-06-2012

How to Cite

[1]
Đinh V. Dũng, “Fabrication and characterization of micromachined piezoresistive displacement sensors”, Vietnam J. Sci. Technol., vol. 48, no. 1, Jun. 2012.

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Articles